This is a family of thermosetting modified epoxy structural adhesives in film form that set at temperatures of 250°F and 350°F. They are available in a variety of weights; with or without a supporting carrier. These films are designed for both solid panels and honeycomb sandwich constructions.
3M Epoxy Film
3M™ Scotch-Weld™ 250 Degree F Cure Epoxy Films
The high peel strength epoxy technology pioneered by 3M for low temperature/low pressure curing adhesive films is now standard throughout the industry for bonding skins to honeycombs.