Saint-Gobain’s Polyimide (PI) film not only can fully meet any general requirements of a wide variety of industrial applications, but it also possess the unique characteristics of high tensile strength, high-wear tolerance, high-temperature tolerance, and anti-corrosion. PI completely meets the industrial design requirement of modern consumer’s electronics, while at the same time, has always been a standard electrical insulation material for decades. It is the high temperature insulation material properties that enable PI film to have absolute competitive advantage over all others.
Polyimide, abbreviated as PI, is a polymer material with imide group. The reaction mechanism involves the addition of diamines and dianhydrides to form polyamic acid, abbreviated as PAA, and then react into polyimide after high temperature, imidization and dehydration.
Because of the excellent thermal, mechanical and chemical properties, PI is always the best choice when specifying high performance polymer materials, especially for applications in electronic and integrated circuit industries that have strict materials specification. PI is in the position of key materials, such as high temperature tape, IC passivation coating, LCD alignment layer, and insulated materials, etc.
Striving to be the best supplier of high performance polymeric films, Saint-Gobain continually strengthen its techniques on research, development and production, persistently producing high value-added product while building up strategic alliance with related industries and individual companies outstanding in their respective fields. Saint-Gobain will reinforce its logistics and distribution system that focus on the global market to keep the latest market status for achieving just-in-time supplies and fast after-sales service aiming at being an international partner, not just a domestic vendor.
FluoroWrap® Polyimide Film
Polyimide films provide excellent electrical, thermal, physical and chemical properties over a wide temperature range in a lightweight package, making them a superior choice for rigorous electrical insulatin applications. FEP coating and lamination from the world’s foremost fluoropolymer processor allows for high temperature adhesion in demanding applications.
Slitting and Packaging
Materials can be provided in flat pads, universal traverse wound, or with our StablEdgeTM technology. Width tolerances on slit materials will be held to 1/64 in.
The standard core will be 3 in. ID cardboard. Split cores are available for universal and StablEdge wound products with a standard length of 2-3/4 in. Roll cores will be of sufficient strength to prevent collapsing from handling. Roll lengths are dependent upon the width of the product and can be customized. Heat sealed splices will be used for longer roll lengths but will be kept to a minimum. Consult customer service for details.
Norton® Polyimide Film
Norton® Polyimide Films provide excellent electrical, thermal, physical and chemical properties over a wide temperature range in a lightweight package (136 sq ft/lb [28 m2/kg] for 1 mil) making them superior for electrical insulation applications.
Taimide® polyimide films are produced employing a world-class process that makes them dimensionally stable and inherently isotropic, meeting exacting tolerances, physically strong and electrical sound in widths up to 61.8 in. (1570 mm). These products meet all the requirements of ASTM D5213 which superseded MIL-P-46112B. TH Series polyimide films exceed UL94 V-0 flammability, as well as a 455°F (235°C) Relative Thermal Index for both electrical and mechanical properties (UL file E231847).
These high performance films are exclusively manufactured to Saint-Gobain’s exacting specifications for the electrical insulation market by Taimide Technology, Inc. (Taiwan).