Ultra-High Thermal Gap Fillers

Faster processing speeds, more stringent performance requirements, and miniaturization in many electronic applications are some of the factors driving demand for new solutions to help meet thermal management challenges. Momentive’s SilCool* ultra-high thermally conductive gap fillers are liquid dispensed silicone materials available in thermal conductivities up to 10 W/m.K. These high thermal conductivities can help solve heat dissipation challenges and provide designers of electronic components with greater design flexibility to achieve performance expectations.
Key Features and Typical Benefits
  • High thermal conductivity
  • Electrically insulative properties
  • Dispensability (easy conformity to 3 dimensional PCB designs)
  • Softness, stress- absorption
  • Repairability
  • Resistance to cracking and sagging (when assembled in typical vertical positions)
Typical Physical Properties

Product Literature

Momentive Solutions
Guide – Electronic
Devices

The products introduced in this selector guide consist of RTV (Room Temperature Vulcanizing) silicone products that are commonly found in Electric and Electronic applications and component assemblies.

Solutions Guide

Product Literature

Momentive Solutions
Guide – Aerospace
&Aviation

From materials used for bonding thermal shields on space shuttles and rockets, to aircraft assembly adhesives and sealants, to vibration-dampening potting materials for vital electronics, our silicone RTVs keep air and spacecraft operating smoothly.

Solutions Guide

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