Thermally Conductive Silicone Adhesives for Electronics

Momentive Performance Materials family of SilCool thermally conductive adhesives can help deliver thin bond lines that contribute to low thermal resistance, and provide excellent adhesion and reliability. This series of heat-cured adhesives excel in thermal interface applications that demand good structural adhesion. Examples include spreaders and heat generators, and thermal interfaces to heat sinks in TIM2 applications.

Other thermal adhesives from Momentive offer the process convenience of 1-part condensation cure with moderate heat dissipation. Potential applications include board assemblies and sealants in power modules and sensors.

SilCool* Silicone Adhesive - Addition Cure

The SilCool series silicone adhesives from Momentive Performance Materials offer 1-part, heat curable materials that bond well to a wide variety of substrates without the need for primers. They offer outstanding thermal conductivity, low thermal resistance, excellent dielectric properties, and low stress. SilCool adhesives are excellent candidates for applications presented with  heat management challenges that arise from the higher frequencies, power, and miniaturization in today’s electronic devices. Able to efficiently conduct heat, these materials have shown to be valuable additions to semiconductor packages that incorporate heat generating chips, heat spreaders, and heat sinks (TIM1 & TIM2).